Diamond cut-off wheels Type LR ⌀ 75 x 0,5 x 12,7 mm
Delivered with a dressing stick. Resin bond. High concentration disc, advised when you want the best cutting quality. To cut hard and fragile materials, composites, plasma deposit, ceramics, electronic components.
Diamond disc Tissediam M, black, 125 µ ⌀ 250 mm
Adhesive metallic bond diamond discs for the leveling or grinding of non-metallic hard materials (ceramic, glass, quartz, …). Delivered with dressing stick.
Resinoid cut-off wheels Type AOF II ⌀ 250 x 0,8 x 32 mm
Pack of 10 cut-off wheels. For cutting rubber bonded cut-off wheel, thin section cutting, low cross-section sintered steels, hard metal layers.
Diamond disc Tissediam M, red, 75 µ ⌀ 300 mm
Adhesive metallic bond diamond discs for the leveling or grinding of non-metallic hard materials (ceramic, glass, quartz, …). Delivered with dressing stick.
Abrasive papers, Type M, non-adhesive, ⌀ 300 mm, P2400
Box of 100. For non metallic soft materials and non-ferrous metallic materials.
Abrasive papers, Type M, non-adhesive, ⌀ 300 mm, P4000
Box of 100. For non metallic soft materials and non-ferrous metallic materials.
Abrasive papers, Type M, non-adhesive, ⌀ 305 mm, P2400
Box of 100. For non metallic soft materials and non-ferrous metallic materials.